加工对象
PCB、BGA、陶瓷基板、及硅晶圆等材料
产品系列 | 粒度 | 结合剂 | 浓度 | kerf | Exp |
S20 | 4000# | BH3 | A | 15-20 | 380-510 |
3500# | BH4 | B | 21-25 | 511-640 | |
3000# | BH5 | C | 26-30 | 641-760 | |
2000# | BH6 | D | 31-25 | 761-890 | |
E | 36-40 | 891-1020 | |||
F |
Kerf/μm | Exp/μm | ||||
380-510 | 511-640 | 891-1020 | 1021-1140 | 1141-1270 | |
15-20 | 1639 | ||||
21-25 | 2139 | 2152 | |||
26-30 | 2639 | 2652 | |||
31-35 | 3139 | 3152 | |||
36-40 | 3652 | 3690 | |||
41-50 | 4152 | 4190 | 41102 | ||
51-60 | 5190 | 51102 | 51114 | ||