1. RDL
规格书：
Item | Single Side RDL | Double Side RDL |
Min Si Thickness | 60um | 60um |
Copper Thickness | >6um | >6um |
Copper Line/Space | Min 10um/10um | Min 10um/10um |
Chip Size | Target ±20um | Target ±20um |
Min Chip Size | 0.6mm×0.3mm | 0.6mm×0.3mm |
Tape&Reel | Min die thickness 90um | Min die thickness 90um |
结构示意图：
2. TSV
规格书：
Item | TSV 10:100 | TSV 20:200 |
Wafer size | 300mm | 300mm |
Si Thickness | 100um±10um | 200um±10um |
Via size | 10um±1.5um | 20um±3um |
Metal layers | Top side：3 | Top side：3 |
Copper Line/Space | Min 10um/10um | Min 10um/10um |
Micro Bump Pitch | Min 40um | Min 40um |
结构示意图：
3. Bumping
规格书：
Item | Wafer Bumping |
Wafer Size | 300mm/200mm |
Bump Pitch | Min 80um |
Bump Size | Min 50um |
Bump Height | <80um |
RDL Line/Space | Min 10um/10um |