无卤,高CTI,铝基覆铜板

单价 面议
浏览 0
发货 广东省东莞市
品牌 BNSN
过期 长期有效
更新 2025-11-15 10:54
 
详细说明
型号: 无卤,高CTI,铝基覆铜板
范围: --
应用行业: 适用本机适用多种产品,大批量生产工件的表面除锈或抛丸强化,广泛应用于铸造、锻压等行业

产品性能:

Remarks:

1. Typical value is based on specimen of 1.5mm Al/100μm dielectric/1oz Cu.

2. All  the typical values listed above are for your reference only and not  intended for specification. Please contact Shengyi Technology Co., Ltd.  for detailed information. All rights from this data sheet are reserved  by Shengyi Technology Co., Ltd.  


Explanation: C=Humidity conditioning, D=Immersion conditioning in distilled water, E=Temperature conditioning  

The first digit following the letter  indicates the duration of preconditioning in hours, the second digit the  preconditioning temperature in and the third digit the relative humidity.

ItemsMethodConditionUnitTypical Value
Thermal ConductivityASTM-D5470AW/ (m•K) 1.1
Thermal ResistanceASTM-D5470AK·cm2/W  0.91
Tg2.4.25DDSC100
Td
2.4.24.6Wt 5% loss410
Thermal Stress2.4.13.1288℃, solder floatmin
30
CTE (Z-axis)2.4.24Before Tgppm/℃27
After Tgppm/℃30
50-260℃%0.74
Volume Resistivity2.5.17.1C-96/35/90MΩ.cm106  
Surface Resistivity
2.5.17.1
C-96/35/90107
Dielectric Breakdown2.5.6D-48/50+D-0.5/23kV6.0
Peel Strength (1oz)2.4.8288℃/10sN/mm1.4
Flammability
UL94
C-48/23/50
Rating
V-0
MOTULA130
CTIIEC60112ARatingPLC0




举报收藏 0