高频电路用电子级玻璃纤维布增强碳氢陶瓷基覆铜板

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发货 广东省东莞市
品牌 永德信
过期 长期有效
更新 2025-11-15 10:54
 
详细说明
型号: LNB33
范围: --
应用行业: 熔喷布,无纺布等产品降温

LNB33

高频电路用电子级玻璃纤维布增强碳氢陶瓷基覆铜板

产品性能:

Remarks:

All the typical values listed above are for your reference only and not intended for specification. Please contact Shengyi Technology Co., Ltd. for detailed information. All rights from this data sheet are reserved by Shengyi Technology Co., Ltd.

Explanation: C=Humidity conditioning, D=Immersion conditioning in distilled water, E=Temperature conditioning
The first digit following the letter indicates the duration of preconditioning in hours, the second digit the preconditioning temperature in ℃ and the third digit the relative humidity.

ItemsMethodConditionUnitTypical Value
Dielectric Constant,
Process Dk
IPC-TM-650 2.5.5.5C-24/23/50, 10GHz-3.30±0.05
Dielectric Constant, DkIEC 61189-2-721C-24/23/50, 10GHz-3.45±0.05
Dissipation Factor, DfIPC-TM-650 2.5.5.5C-24/23/50, 10GHz-0.0025
IEC 61189-2-721C-24/23/50, 10GHz-0.0032
Thermal Coefficient of DkIEC 61189-2-721
-40~150℃, 10GHzppm/℃+125
Volume ResistivityIPC-TM-650 2.5.17.1AMΩ·cm6.8 x 108
Surface Resistivity
IPC-TM-650 2.5.17.1
A5.3 x 107
TgIPC-TM-650 2.4.25DSC>280
TdIPC-TM-650 2.4.24.65% wt. loss>400
CTE (Z-axis)IPC-TM-650 2.4.2430-260℃ppm/℃55
CTE (X/Y-axis)
IPC-TM-650 2.4.4130-260℃ppm/℃13/15
Peel StrengthIPC-TM-650 2.4.8288℃/10sN/mm [lb/in]1.0 [5.71]
Flexual StrengthIPC-TM-650 2.4.4AMPa235
Water AbsorptionIPC-TM-650 2.6.2.1D-24/23%0.1
Thermal Conductivity
ASTM D5470100℃W/(m·k)0.69
Tensile Modulus (LW/CW)ASTM D638AGPa
15.6/19.7
Tensile Strength (LW/CW)ASTM D638AMPa112/143


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